PP&M TUF Meetings

The SmartPlant Electrical and SmartPlant Instrumentation Technical User forums are open for all current users of these two Intergraph solutions.

Abstract coming soon

The SPEL TUF provides a forum for the exchange of ideas between fellow users and Intergraph representatives. New clients and users are encouraged to attend and become involved in product direction. Like in previous years, as part of evolving into one E&I solution, we will have a joint session, at the first part of the day to topics to subjects that are of common interests to both disciplines- we will introduce SPI and SPEL roadmaps. This year we will be introducing our new member of the schematics tools, Sigraph.CAE and talk about Intergraph vision of integrating Sigraph into the SmartPlant suite of tools. In the breakout session the Electrical forum will have a short presentation of the new features of the next SPEL release, team members will have the opportunity to rank new development requests and exchange ideas on various subjects such as design cases, cable management system and more.

The Process, Design & Engineering individual TUFs will meet together. This is open to all current users of Intergraph’s SmartPlant P&ID solution. The meeting will provide a forum to exchange ideas among fellow users and Intergraph representatives. During the session, the chairs of the individual TUFs will discuss the activities and achievements from the previous year and the upcoming planned events. There will also be a brief overview of upcoming releases for SmartPlant P&ID, followed by a question-and-answer period.

The individual PEHM (Piping, Equipment and HVAC), Visualization, and Structural TUFs will meet together to begin the day, followed by subject-area breakouts in the afternoon. The morning session will include a brief review of TUF offers and roles. This will be followed by discussions of interest to Intergraph 3D and visualization customers in general, including improvements to performance and usability in 3D applications, the integration of PDS and SmartPlant 3D, and TUF survey results on technology/IT directions and their near- and midterm impacts on 3D.

The PDS subject-area breakout will include requirements discussions. Intergraph will provide an overview of its understanding of market requirements along with current plans for meeting them. Currently planned is a discussion of the improvements that Intergraph has planned for 2011. Intergraph would like to gather requirements how to further improve the workflow. Also to be discussed are new publishing capabilities for SmartPlant Review, SmartPlant Foundation, and SmartPlant Construction. Additionally, the session will collect and discuss requirements for the next PDS releases. Action items for 2010-2011 will be determined.

The SmartPlant 3D subject-area breakout will include three requirements discussions, where Intergraph will provide an overview of its understanding of market requirements along with current plans for meeting them. An open-forum discussion will then occur where users can provide feedback in the form of corrections, clarifications, and general statements on fitness for use and/or appropriateness of prioritization. During the last 15 minutes of each requirements discussion, all attendees will be asked to fill out a survey on the topic of discussion, thus allowing everyone in attendance ample opportunity to provide critical input. Current requirements discussions planned are: Duct Roadmap for Smart 3D Products, Hetero-3D Workflows with Smart 3D Products, and Electrical Design.

In this breakout session of the Visualization TUF, the current officer positions and proposed organizational changes will be reviewed. In addition, the new 3D navigation and user experience enhancements planned for release later this year will be evaluated in detail. Attendees will be asked to complete a survey. Anyone with ideas on how to improve the casual user experience when navigating the 3D model in any phases of the project will want to attend. Experience in SmartPlant 3D, SmartMarine 3D, SmartPlant Review, or SmartPlant Foundation is useful but not required as the group discusses and prioritizes visualization requests and market requirements.

The Structural TUF breakout session will include a review and open discussion of the new "Agile" development process (Scrum) being deployed throughout Intergraph PP&M. Emphasis will be placed on involving the TUF members into this process to provide continued guidance into requirements and priority of development activities. A discussion of the new features coming out in 2009 will be highlighted. An open forum will occur for the discussion of TUF officer and organization changes. Time will also be allocated to evaluate future enhancements and work processes. Also, examination of the Structural Roadmap that will cover the next several releases will be discussed.

The SmartPlant Information Management and Integration (IM&I) Technical User Forum (TUF) is open to all current users of Intergraph's SmartPlant Foundation, AIM, Directa, SmartPlant Markup, and integration technology.

The SmartPlant Materials Technical User Forum (TUF) is open to all current users of Intergraph's SmartPlant Materials product suite. This TUF provides a forum for exchange of ideas between fellow users and Intergraph representatives.

With the recent introduction of this TUF, emphasis for the Architectural breakout session will include the formation of the organization and the establishment of officers. Time will be allocated to familiarize the members with Intergraph organizations, review current functionality for the Architectural discipline, and identify vehicles of communication. There will be a more detail explanation of the new "Agile" development process (Scrum) being deployed throughout Intergraph PP&M. Emphasis will be placed on involving the TUF members into this process to provide guidance into requirements and priority of development activities. An open forum will occur for the discussion of immediate needs in the area of architecture modeling. Also, methods to start and implement SmartPlant 3D within your company will be discussed.